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乐泰 SI 5293 is designed to provide environmentalprotection for printed circuit boards and other sensitive electronic components.
TYPICAL PROPERTIES OF UNCURED MATERIALSpecific Gravity @ 25 °C 1.0Flash Point - See SDSViscosity, Brookfield - RVT, 25 °C, :Spindle 1, speed 10 rpm 400 to 800LMSSolids/Non-Volatile Content, % ≥85LMSTYPICAL CURING PERFORMANCE乐泰 SI 5293 cures when exposed to UV radiation of 365nm.
Normal processing conditions will include exposure to sufficientUV light irradiance to effectively cure the material. Surfaceand/or atmospheric moisture will promote the cure of materialin shadowed regions.
Although functional strength isdeveloped almost instantly due to the UV curing nature of 乐泰 SI 5293, increased cure properties are developedduring 72 hours at ambient conditions.Surface CureTack Free Time, hours:Cured @ 22 °C / 50±5 % RH 10 to 24LMSStorageStore product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C orgreate |
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