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乐泰 3513 is a single component, epoxy adhesive
designed for use as a reworkable underfill resin for
CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is
designed to give excellent protection from failure due to
mechanical stress. The low viscosity allows filling in gaps
under CSP or BGA.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.15
Viscosity, Cone & Plate, mPa•s (cP),
Temperature: 25 °C, Shear Rate: 36 s
-1:
3,000 to 6,000LMS
Pot life @ 22 °C, hours 48
Flash Point - See SDS
Recommended Curing Conditions
10 minutes @ 150 °C
15 minutes @ 120 °C
30 minutes @ 100 °C
Note: With all fast cure systems, the time required for cure
depends on the rate of heating. Conditions where a hot plate
or heat sink is used are optimum for fastest cure. Cure rates
depend on the mass of material to be heated and intimate
contact with the heat source. Use suggested cure conditions
as general guidelines. Other cure conditions may yield
satisfactory results. Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than
8 °C can adversely affect product properties.
乐泰 3513是单组分环氧胶粘剂
设计用作可再加工的底部填充树脂
CSP（FBGA）或BGA。它在暴露于热量时迅速治愈。它是
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