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技术服务热线:021-51693135 / 021-22818476
乐泰 3536 epoxy reworkable underfill is designed to
provide protection for solder joints against mechanical stress
such as shock, drop and vibration.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP52, 25 °C, mPa•s (cP):
Speed 20 rpm 18,000
Pot Life @ 25oC, days >14
Shelf Life @ 2 to 8°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
5 minutes @ 120°C
2 minutes @ 130°C
Curing above 140°C is not recommended.
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties.
乐泰 3536环氧树脂可再加工底层填料设计
提供针对机械应力的焊点保护
如震动,跌落和振动。
固化材料的典型特性
粘度,Brookfield CP52,25℃,mPa•s(cP):
速度20转18,000
天气25℃,天> 14
保质期2至8°C,365天
闪点 - 见SDS
典型的固化性能
推荐治疗时间表
在120°C下5分钟
在130°C下2分钟
不建议在140°C以上固化。
以上治疗方案是指导性建议。治愈
条件(时间和温度)可能会根据客户的 |
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