环氧胶 汉高汉高乐泰乐泰 3217
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乐泰 3217
乐泰 3217 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. The maximum performance of this material is achieved by exposure to UV light of suffecient intensity, followed by thermal cure.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE PK-100, Cone PK 1 2o, @ 25 °C, mPa·s (cP):
@ Shear rate of 2 s-1 109,000
@ Shear rate of 20 s-1 37,600
Yield Point @ 25 °C, mPa·s (cP) 116,900
Thixotropic Index (2/20 s-1 ) 2.9
Specific Gravity 1.2
Pot life @ 25 °C, days >14
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended UV Cure
Light Source and Condition:
Medium pressure mercury lamp
UV Wavelength, nm 220 to 260
Light Intensity, mW/cm2 100
UV Tack-Free Time, seconds 1
Recommended Heat Cure
30 minutes @ 60°C
25 minutes @ 70°C
20 minutes @ 80°C
The above cure profile is a guideline recommendation. Cure rate and ultimate depth of cure depend on light intensity, spectral distribution of light source, exposure time and the light transmittance of the substrate.
With all fast cure systems, the minimum required time for cure depends on the rate of heating. Cure rate depends on the mass of the material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.
TYPICAL PROPERTIES OF CURED MATERIAL
Sample cured 5 secs @ 100 mW/cm2 plus 30 min @ 80°C
Physical Properties:
Hardness, Shore D, ASTM D2240 86
Glass Transition Temperature (Tg) by TMA, °C 82
Coefficient of Thermal Expansion :
Alpha 1, cm/cm/oC 53×10-6
Alpha 2, cm/cm/oC 178×10-6
Volume Shrinkage on Cure, % 5.6
Linear Shrinkage on Cure, % 1.1
乐泰3217双固化胶粘剂是专为使用温度敏感的电子元件组装。这种材料的*大性能是通过暴露于UV光实现充分的强度，其次是热固化。
固化材料的典型性能
粘度，哈克pk-100，锥PK 1 2o，@ 25°C，MPA·S（CP）：
@ 2 s-1的剪切 |
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