汉高汉高乐泰乐泰 Eccobond DX-20C
技术服务热线：021-51693135 / 021-22818476
乐泰 ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, mPa∙s (cP):
@ 25°C Speed 10 rpm 12,000
Specific Gravity 1.17
Work Life @ 25°C, days 5
Shelf Life @ -20°C, months 6
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 170°C
Time shown does not include ramp-up time to cure temperaure.
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties :
Moisture Absorption @ Saturation, wt.%,
60oC/90% RH exposure for 24 hrs
0.6
TYPICAL PERFORMANCE OF CURED MATERIAL
Cured at 170°C for 1 hour
Die Shear Strength :
1.25 x 1.25 mm Si die on Ag plated Cu, N
@ 25°C
125
1.25 x 1.25 mm Si die on Ag plated Cu, N
@ 160°C
49
dx20c绝缘胶乐泰 ABLESTIK提供优良的粘合强度，特别是在引线键合过程中温度降低装配缺陷率。它具有强大的热/紫外线电阻，可应用于引脚转移，冲压和配药。
固化材料的典型性能
粘度、锥板、MPA∙S（CP）：
@ 25°C转速10转12000
比重1.17
工作生活@ 25°C，天5
保质期@ 20°C，月6
闪点-见SDS
典型的固化性能
治疗计划
1小时@ 170°C
时间显示不包括升温时间的固化温度。
上述固化型材指南建议。固化条件（时间和温度）可能会根据客户的经验和他们的应用要求，以及客户固化设备，烘箱负荷和实际烤箱温度变化。
固化材料的典型性能
物理性质：
水分吸收@饱和度，重量%，
60oC / 90% RH暴露24小时 |
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