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乐泰 ABLESTIK ICP 3540 electrically conductive adhesive is designed for circuit assembly applications. It is specifically recommended for mounting active and passive components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. This material is designed for applications with small size components (0603, 0402) where no bleeding or wicking is tolerated. 乐泰 ABLESTIK ICP 3540 can be dispensed with commonly used time-pressure and auger valve technology and can be applied by stencil or screen printing. 乐泰 ABLESTIK ICP 3540 electrically conductive epoxy adhesive is designed to provide excellent contact resistance and adhesion stability after 85%RH/85oC temperature humidity and -40oC/+150oC thermoshock testing with AgPd-finished components. TYPICAL PROPERTIES OF UNCURED MATERIAL Viscosity @ 25oC: Plate 2 cm @ Shear rate 15 s -1 , mPa∙s (cP) 70,000 Pot Life @ 18 to 25oC, hours 16 Shelf Life @ -40°C (from date of manufacture), days 183 Flash Point - See MSDS TYPICAL CURING PERFORMANCE Cure Schedule 20 minutes @ 150°C The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as custome |
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