乐泰 454平板电脑/笔记本ipad专用胶水，乐泰胶水
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乐泰® 454™ is designed for the assembly of difficultto-bond materials which require uniform stress distribution and strong tension and/or shear strength. The product provides rapid bonding of a wide range of materials, including metals, plastics and elastomers. 乐泰® 454™ is particularly suited for bonding porous or absorbent materials such as wood, paper, leather and fabric. The gel consistency prevents adhesive flow even on vertical surfaces. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.1 Flash Point - See MSDS Casson Viscosity, 25 °C, mPa•s (cP): Cone and plate rheometer 100 to 300LMS Viscosity, Brookfield - RVT, 25 °C, mPa•s (cP): Spindle TC, speed 2.5 rpm, Helipath 100,000 to 300,000 Spindle TC, speed 20 rpm, Helipath 18,000 to 40,000 TYPICAL CURING PERFORMANCE Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24 hours before full chemical/solvent resistance is developed. Cure Speed vs. Substrate The rate of cure will depend on the substrate used. The table below shows the fixture time achieved on different materials at 22 °C / 50 % relative humidity. This is defined as the time to develop a shear strength of 0.1 N/mm2. Fixture Time, seconds: Steel 60 to 210 Aluminum 3 to 10 Zinc dichromate 5 to 20 Neoprene 15 to 20 Rubber, nitrile 5 to 15 ABS 3 to 10 PVC 5 to 10 Polycarbonate 5 to 10 Phenolic 5 to 30 Wood (balsa)
乐泰®454™设计用于组装困难粘合材料，需要均匀的应力分布和强烈的张力和/或剪切强度。该产品可以快速粘合各种材料，包括金属，塑料和弹性体。 乐泰®454™特别适用于粘合多孔或吸收材料如木材，纸张，皮革和织物。凝胶一致性即使在垂直表面上也能防止粘合剂流动。固化材料的典型特性25°C时的比重1.1闪点 - 参见MSDS卡森粘度，25°C，mPa•s（cP）：锥形和板式流变仪100至300LMS粘度，Brookfield-RVT，25°C，mPa• s（cP）：主轴TC，转速2.5 rpm，Helipath 100,000至300,000主轴TC，转速20 rpm， |
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