HYSOL KL-5100HT电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
技术服务热线:021-51693135 / 021-22818476
Product ℃ HYSOL KL-5100HT Description High thermal conductivity molding material designed to improve the thermal transmission properties of semiconductor devices.
Recommended for isolated power transistors requiring high thermal transmission properties 2 W / mK N / A MSL N / A linear flow, cm 38 hot plate gel time, second 35 filled content% 83 CTEa1, ppM / ℃ 20 Tg, 160 Main features High thermal conductivity;
Excellent formability; Excellent electrical properties
产品℃HYSOL KL-5100HT描述 高导热塑封料,设计用于改善半导体器件热 传播属性。
推荐用于需要高热传播属性的隔 离功率晶体管 导热率2 W/mK N/A MSL N/A 线性流 动,厘米 38热板凝胶 时间,秒35 填充含 量 % 83 CTEa1, ppM/℃ 20 Tg,160
主要特点 高导热性;优良的成形性;优异的电性能 |