ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/ECCOBOND E3200电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND E3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity Brookfield, map (cap)10 rpm,150,000Sag Resistance, inches 0.5Specific Gravity 1.15Shelf Life @ -18°C, days 90Flash Point - See
MSDSTYPICAL CURING PERFORMANCE Cure Schedule-20 minutes @ 100°C or10 minutes @ 110°C or5 minutes @ 120°CThe above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based noncustomers’' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Hardness, Shore D 78Temperature Range of Use, °C -25 to 100StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.Optimal Storage: -18 °C
ECCOBOND E3200被设计为化学耐受，快速和低温热固化粘合剂，用于粘合不相似的工程基材。
固化材料的特性粘度Brookfield，mPa（cap）10 rpm，150,000抗锯齿度，英寸0.5特殊重力1.15Shelf寿命@ -18° C，90天闪点 - 参见MSDSTYPICAL CURING PERFORMANCECURE Schedule-20 minutes @ 100°C or10分钟@ 110°C或5分钟@ 120°CT以上治疗方案是指导性建议。
治愈条件（时间和温度）可能会根据客户的经验和应用要求以及客户固化设备，烤箱装载和实际温度而有所不同。
固化材料的典型特性物理性能：硬度，肖氏D 78使用温度范围°C -25至100储存在未开封容器中的产品在干燥的位置。存储信息可能在产品容器标签上显示。
*佳储存：-18° |
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