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乐泰 384 is a thermally conductive adhesive systemdesigned for bonding heat generating components to heat sinks.
The high thermal conductivity provides excellent heatdissipation for thermally sensitive components, while thecontrolled strength permits field and service repair.
In high potapplications this product should be limited to a maximum of500 volts. Typical applications include bonding transformers,transistors and other heat generating electronic components toprinted circuit board assemblies or heat sinks.
TYPICAL PROPERTIES OF UNCURED MATERIALSpecific Gravity @ 25 °C 1.64Flash Point - See SDSViscosity, Brookfield - HBT, 25 °C, mPa•s (cP):
Spindle TE, speed 2.5 rpm, , Helipath 500,000 to 2,250,000LMSSpindle TE, speed 20 rpm, Helipath 300,000 to 800,000LMSTYPICAL PROPERTIES OF CURED MATERIALPhysical PropertiesCoefficient of Thermal Expansion,ISO 11359-2, K-169×10-6Coefficient of Thermal Conductivity, ISO 8302,W/(m•K)0.757Elongation, at break, ISO 527-3, % 0.9Tensile Strength, at break, ISO 527-3 N/mm2 13(psi) (1,800)Young's Modulus N/mm2 2,800 (psi) (400,000)Electrical PropertiesVolume Resistivity, IEC 60093, Ω•cm 1.3×1012Surface Resistivity, IEC 60093, Ω 5.1×1013Dielectric Breakdown Strength, IEC 60243-1, kV/mm 26.7Dielectric Constant / Dissipation Factor, IEC 60250:100-Hz 6.48 / 0.11-kHz 5.86 / 0.041-MHz 5.22 / 0.03 StorageStore product in the unopened container in a dry location.
乐泰 384是一种热传导粘合剂系统，用于将发热部件粘合到加热中水槽高导热性为热敏元件提供出色的散热性，而受控的强度允许现场和维修。
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