乐泰 3874电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰 3874 is a thermally conductive adhesive. When usedwith Activator 7387™, it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer.
Typicalapplications include bonding heat sinks to heat dissipatingcomponents such as BGAs in electronics applications. Thethixotropic nature of 乐泰 3874 reduces the migration ofliquid product after application to the substrate.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 2.08Flash Point - See SDSViscosity, Brookfield - HBT, 25 °C, mPa•s (cP):Spindle TB, speed 0.5 rpm, Helipath 800,000 to 1,800,000LMSSpindle TB, speed 5 rpm, Helipath 200,000 to 450,000LMS Cure Speed vs. SubstrateThe rate of cure will depend on the substrate used. The graphbelow shows the shear strength developed with time on gritblasted steel lap shears and tested according to ISO 4587.(Activator 7387™ applied to one surface).
StorageStore product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than8 °C can adversely affect product properties.
乐泰 3874是导热粘合剂。
当与Activator 7387™一起使用时，它可快速固化，形成高温强度，高模量，热固性丙烯酸聚合物。
典型应用包括将散热片连接到散热部件，如电子应用中的BGA。
乐泰 3874的触变性降低了应用于基材后液体产品的迁移。
固化材料的特性比重@ 25°C 2.08闪点 - 参见SDSViscosity，Brookfield - HBT，25°C，mPa•s（cP）：主轴TB，转速0.5 rpm，Helipath 800,000至1,800,000LMS主轴TB，转速5 rpm，Helipath 20万至45万LMS固化速度与底物固化速率取决于所用的底物。
曲线图显示了经过喷砂钢绞线剪切力随时间推移的剪切强度，并根据ISO 4587测试（活化剂7387™应用于一个表面）。
StorageStore产品在未开封的容器中干燥处。
存储信息可能在产品容器标签上显示。
*佳储存：2°C至8°C。低于2°C或高于8°C的储存可能会对产品性能产生不利影响 |
免责声明：以上所展示的信息由会员自行提供，内容的真实性、准确性和合法性由发布会员负责，www.qy6.com对此不承担任何责任。如有侵犯您的权益，请来信通知删除。