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乐泰 ABLESTIK 84-1LMI die attach adhesive is designedfor microelectronic chip bonding applications. This adhesive is ideal forapplication by automatic dispenser or hand probe.
MIL-STD-883
乐泰 ABLESTIK 84-1LMI meets the requirements of MIL-STD-883, Method 5011.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 4.0
Viscosity, Brookfield CP51, 25 °C, mPa•s (cP):
Speed 5 rpm 30,000
Work Life @ 25°C, days 14
Shelf Life (from date of manufacture):
@ 5°C, days 91
@ -10°C, days 183
@ -40oC, days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 150°C
Alternate Cure Schedule
2 hours @ 125°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties.
乐泰 ABLESTIK 84-1LMI芯片附着胶被设计用于微电子芯片接合应用。这种粘合剂是理想的应用自动分配器或手动探头。
MIL-STD-883
乐泰 ABLESTIK 84-1LMI符合MIL-STD-
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