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乐泰 ECCOBOND UF 8807 is formulated using a novel MoistureResistant Cyanate Ester (MRCE) chemistry. This material'scharacteristics help to reduce thermal and mechanical stressesbetween CSP packages and HDI subtrates in MPM applications. Anoptimized particle size distribution allows 乐泰 ECCOBOND UF8807 adhesive to flow rapidly into gaps of 10 mil and greater to form aprotective polymer when cured.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 0.75
Viscosity Brookfield CP51, 5 rpm @ 25°C, mPa•s (cP) 13,000
Particle Size, μm:
Average ≤25
Maximum ≤50
Shelf Life @ -40°C (from date of manufacture), days 365
Work Life @ 25°C, hours 8
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
15 minute ramp to 165°C + 30 minutes @ 165°C
Alternate Cure Schedule
3 hours @ 125°C
Substrate Temperature
80°C (70°C - 90°C)
Weight Loss on Cure
Weight Loss on Cure, % 0.8
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures. Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties. 乐泰 ECCOBOND UF 8807采用新 |
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