ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/ECCOBOND C990电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
ECCOBOND C990 die attach is versatile and is designed for
microelectronic applications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa•s (cP):
Speed 10 rpm, #TC 21,000 to 60,000
Specific Gravity 2.9
Shelf Life @ 0°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
1 hours @ 150°C
Snap Cure Condition
20 seconds @ 275°C
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 0 °C
ECCOBOND C990芯片附件是多功能的，专为
微电子应用。
固化材料的典型特性
粘度，Brookfield，25°C，mPa•s（cP）：
速度10 rpm，#TC 21,000至60,000
比重2.9
保质期0°C，月6
闪点 - 参见MSDS
典型的固化性能
推荐治疗时间表
150℃下1小时
捕捉条件
275°C 20秒
以上治疗方案是指导性建议。
治疗条件（时间和温度）可能会有所不同
客户的经验和应用要求
以及客户固化设备，烤箱装载和实际
烘箱温度。存储
将产品存放在未开封的容器中，干燥处。
存储信息可能会在产品容 |
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