乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/乐泰 3609电子组装/工业胶水/电子组装胶水/工业用胶
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乐泰 3609 is designed for the bonding of surface mounted
devices to printed circuit boards prior to wave soldering.
Particularly suited for applications where medium to high
dispense speeds, high dot profile, high wet strength and good
electrical characteristics are required. 乐泰 3609 has been
used successfully in lead free processes with water and
alcohol based fluxes under conditions outlined in the
Environmental Resistance section.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.2
Particle Size, μm <150
Flash Point - See SDS
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 700LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
0.16 to 2.0
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity
curve as measured using a Haake rotoviscometer PK100,
M10/PK1 2° Cone system at a shear rate of 2 s
-1 which is
representative of the shear rate in the dispense nozzle.
Increased cabin or nozzle temperature in the 30°C to 35°C
range may aid dispense performance at higher dispense
speeds. Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than
8 °C can adversely affect product properties.
乐泰 3609设计用于表面贴装
设备到波峰焊前的印刷电路板。
特别适用于中至高的应用
分配速度快，圆点状，高湿强度好
需要电气特性。 乐泰 3609已经
成功用于无铅流程与水和
醇基助焊剂在条件下概述
环保部分。
固化材料的典型特性
比重@ 25°C 1.2
粒度，μm<150
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