CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3
CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3
CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3 CONATHANE UF-3
CONATHANE UF-3 is suggested for use in packaging electronic components and assemblies. When properly mixed and poured into a cavity, the liquid system expands to fill the void spaces and cures at room temperature. The foam adheres firmly to most clean surfaces and will reduce weight by as much as 75%. |
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