汉高汉高 乐泰乐泰 贴片红胶 Chipbond 348
技术服务热线：021-51693135 / 021-22818476
乐泰®348™ is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.2
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
300 to 700LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone 1 to 5
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at the cure temperature. Cure Speed vs. Time, Temperature The following graph shows the rate of torque strength developed with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow for heat up period. Strength is measured on 1206 capacitors @ 22 °C, tested according to IPC SM817, TM-650 Method 2.4.42 |
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