环氧胶 汉高汉高 乐泰乐泰 3128
技术服务热线：021-51693135 / 021-22818476
乐泰 3128
乐泰 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.6
Yield Point, 25 °C, mPa·s
Cone & Plate Rheometer
44,000
Casson Viscosity @ 25 °C, mPa·s (cP)
Cone & Plate Rheometer
7,000 to 27,000LMS
Pot life @ 25 °C, weeks 3
Shelf Life @ -25 to -15 °C, days 365
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
20 minutes @ 80 °C bondline temperature
60 minutes @ 60 °C bondline temperature
Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 60 minutes @ 80 °C
Physical Properties
Density @ 25 °C, g/cm3 1.7
Volume Shrinkage, ASTM D 792, % 3.1
Linear Shrinkage, ASTM D 792, % 1.0
Shore Hardness, ISO 868, Durometer D 88
Glass Transition Temperature, °C:
(Tg) via TMA , ISO 11359-2 45
Coefficient of Thermal Expansion,
ISO 11359-2, K-1:
alpha 1 40×10-6
alpha 2 130×10-6
Water Absorption, ISO 62, %:
24 hours in water @ 23 °C 0.17
Elongation, at break, ISO 527-3, % 2.3
乐泰3128
乐泰3128是一一部分，热固化环氧树脂。本产品的目的是在低温下固化，并在相当短的时间内提供了良好的附着力在广泛的材料。典型的应用包括记忆卡，CCD或CMOS组件。特别适合于低固化温度所需的热敏元件。
固化材料的典型性能
比重@ 25°C 1.6
屈服点，25°C，MPa
锥板流变仪
四万四千
卡森粘度@ 25°C，MPA•S（CP）
锥板流变仪
7000 27000lms
锅寿命@ 25°C，周3
保质期@ 25至15°C，第365天
典型的固化性能
推荐固化条件
20分钟@ 80°胶层温度C
60分钟@ 60°胶层温度C
注：必须添加足够的时 |
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