汉高汉高乐泰乐泰 3129
技术服务热线：021-51693135 / 021-22818476
乐泰 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.52
Viscosity @ 25°C, mPa•s (cP):
Haake PK100, Cone PK1, 2°:
Shear rate @ 2 s
-1 46,000
Shear rate @ 20 s
-1 12,000
Casson Viscosity @ 25 °C, mPa•s (cP):
Haake PK100, Cone PK1, 2° 4,200
Yield Point, 25 °C, mPa•s 39,000
Pot life @ 25 °C, days >21
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
5 to 10 minutes @ 80 °C
Note: With all fast cure systems, the time required for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 30 minutes @ 80 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K
-1:
alpha 1 47
alpha 2 145
Glass Transition Temperature, °C:
(Tg) via DMA 35
Storage Modulus, @ 25°C by DMA GPa 5.4
(psi) (780,000)
Tensile Modulus MPa 200
(psi) (29,000)
Tensile Strength MPa 36.4
(psi) (5,300)
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 30 minutes @ 80 °C
Lap Shear Strength, ISO 4587:
Epoxyglass N/mm2 15.4
(psi) (2,230)
乐泰3129是一一部分，热固化环氧树脂。本产品的目的是在低温下固化，并在相当短的时间内提供了良好的附着力在广泛的材料。典型的应用包括记忆卡，CCD或CMOS组件。特别适合于低固化温度所需的热敏元件。
固化材料的典型性能
比重@ 25°C 1.52
粘度@ 25°C，MPa•s（ |
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