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乐泰® 3523™ is used to bond, seal or coat metal and glass components in industrial applications. This product is suitable for reinforcement of flexible PCB and for bonding a wide range of materials. When cured, it offers excellent flexibility and toughness, making it highly resistant to vibration and impact forces. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.06 Refractive Index, ASTM D 1218 1.48 Flash Point - See MSDS Viscosity, Brookfield - RVF, 25 °C, mPa•s (cP): Spindle 6, speed 20 rpm 16,000 to 24,000LMS TYPICAL CURING PERFORMANCE 乐泰® 3523™ cures when exposed to UV radiation of 365 nm. To obtain full cure on surfaces exposed to air, radiation @ 220 to 260 nm is also required. The speed of cure and depth of cure will depend upon the UV intensity and spectral distribution of the light source, the exposure time and the light transmittance of the substrates.
乐泰®
3523™用于粘合，密封或涂上金属和
玻璃组件在工业应用中。这个产品是
适用于加强柔性PCB和粘接a
范围广泛的材料。治愈时，它提供优秀
灵活性和韧性，使其具有高抗振性
和冲击力。
固化材料的典型特性
比重@ 25°C 1.06
折射率ASTM D 1218 1.48
闪点 - 参见MSDS
粘度，Brookfie |
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