HYSOL GR15F-1电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
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Product temperature HYSOL GR15F-1 Description Acid anhydride curing molding compound with spherical packing designed for applications requiring high pressure, high power and / or high temperature performance.
Thermal conductivity 0.85 W / Mk MSL L1 / 260 ° C Linear flow, cm 80 Hot plate Glue time, seconds 28 filled content% 75 CTEa1, ppM / ℃ 18 Tg, 210
main features for high pressure applications
产品℃HYSOL GR15F-1 描述 酸酐固化塑封料含球形填料,设计适用于需 要高压、高功率和 / 或高温性能的应用.
导热率0.85 W/Mk MSL L1/260℃ 线性流 动,厘米 80 热板凝胶 时间,秒 28 填充含 量 % 75 CTEa1, ppM/℃ 18 Tg, 210
主要特点 适用于高压应用 |
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