HYSOL KL-G800H电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
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KL-G800H epoxy molding compound is suitable forthin leaded package without any flame retardant..
This materialis designed to achieve JEDEC Level 2 requirements, at 260°Creflow temperature.
KL-G800H meets UL 94 V-0 Flammability at 3.175mm hickness.TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 28
Spiral Flow, @ 175°C, cm 115Shelf Life:@ 5oC, months 6TYPICAL PROCESS DATAHandling
Preheat Temperature :Conventional mold, °C 80 to 100Automold, seconds 0 to 5Molding Temperature, °C 150 to 195Molding Pressure, Kg/cm2 40 to 100Transfer Time:
Conventional mold, seconds 10 to 15Automold, seconds 4 to 10Curing Time, @ 175oC, seconds:Conventional mold, 70 to 120Automold, 70 to 90Post Cure @ 175°C, hours 4 to 6
KL-G800H has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible. Althoughmolding and curing conditions will vary from situation to situation,recommended starting ranges are shown above.StorageStore product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Powder Storage - Powder or preforms should be stored at 5oC or below, in closed containers.
After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisture contamination.
The suggested waiting time for a standard 15kg carton box is 24 hours
KL-G800H环氧树脂成型复合材料适用于不含阻燃剂的引线封装。
该材料设计达到JEDEC二级要求，260°起流温度. KL-G800H符合UL 94 V-0易燃性3.175mm厚度。固化材料的特性：175°C，秒28螺旋流，@ 175°C，cm 115Shelf寿命：@5oC，月6个工艺流程数据处理预热温度：常规模具，℃80至100Automold，秒0至5模具温度，℃150至195压铸压力，Kg /cm240至100转印时间：常规模具，秒10至15Automold，秒4至10℃时间，175℃，秒：常规模具，70至120Automold，70至90固化175℃，小时4至6华为KL-G800H已经被制定为尽可能提供*好的可塑性和宽的成型纬度。
虽然模具和固化条件将因情况而异，但推荐的起始范围如上所示。
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