ABLEBOND 84-1LMISR4电子组装/工业胶水/电子组装胶水/工业用胶
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乐泰 ABLESTIK 84-1LMISR4 electrically conductive die attachadhesive has been formulated for use in high throughput, automateddie attach equipment.
The rheology of 乐泰 ABLESTIK84-1LMISR4 adhesive allows minimum adhesive dispense and die put
down dwell times, without tailing or stringing problems.
The unique combination of adhesive properties makes this materialone of the most widely used die attach materials in the semiconductorindustry.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 5.6
Viscosity, Brookfield CP51, 25 °C, mPa•s (cP):
Speed 5 rpm 8,000
Work Life @ 25 °C, Physical worklife by % filler, hours 18
Shelf Life @ -40°C (from date of manufacture), days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 175°C
Alternate Cure Schedule
3 to 5 minute ramp to 175°C + 1 hour @ 175°C (1)
Weight Loss
10 x 10 mm Si die on glass slide, % 5.3
(1)The ramp was observed to yield reduced bondline voiding andincreased strength.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties.
乐泰 ABLESTIK 84-1LMISR4导电芯片贴片胶粘剂已被配制成用于高通量，自动化贴片设备。 乐泰 ABLESTIK的流变学84-1LMISR4胶粘剂允许*小的粘合剂分配和模具放置停留时间，没有拖尾或拉绳问题。
粘合性能的独特组合使得这种材料半导体中*广泛使用的芯片附着材料之一行业。
固化材料的典型特性
触变指数（0.5 / 5 rpm）5.6
粘度，Brookfield CP51,25℃，mPa•s（cP）：
速度5转8,000
25°C的工作生活，填充物的体力活力，小时18
保质期@ -40°C（制造日期），第 |
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