ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/ABLEBOND 958-11电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
ABLEBOND®958-11 adhesive is designed to absorb stressesproduced when bonding large ICs.
MIL-STD-883
ABLEBOND®
958-11 meets the requirements of MIL-STD-
883, Method 5011.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 40,000 to 50,000
Work Life @ 25°C, weeks 2
Shelf Life @ -40°C (from date of manufacture), year 1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
2 hours @ 130°C
Alternative Cure Schedule 1
1 hour @ 150°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C orgreater than minus (-)40 °C can adversely affect product
properties.
ABLEBOND®958-11粘合剂设计用于吸收应力当大IC集成时产生。
MIL-STD-883
ABLEBOND®
958-11符合MIL-STD-
883，方法5011。
固化材料的典型特性
粘度@ 25℃，mPa•s（cP）40,000〜50,000
工作生活@ 25°C，第2周
保质期@ -40°C（从制造日期），第1年
闪点 - 参见MSDS
典型的固化性能
治愈时间表
2小时@ 130°C
替代治疗附表1
150℃下1小时
以上治疗方案是指导性建议。治愈条件（时间和温度）可能会根据客户的经验及其应用要求，以及客户
固化设备，烤箱加载和实际烤箱温度
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