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乐泰 ABLESTIK 561K is designed for substrate attach and heatsink bonding. This adhesive film is designed for bonding materials withseverely mismatched coefficients of thermal expansion. All dataand results will vary with different thicknesses.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Work Life @ 25°C, days 183
Shelf Life @ -40°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Alternate Cure Schedule
2 hours @ 125°C
Percent Volatiles
10 x 10cm sample @ 120°C for 30 minutes, % 0.16
Curing film adhesives under pressure to ensure properwetting of the adherend surfaces is recommended. Pressurerequirements will vary from (2 to 200 psi) depending on theseverity of the adherends warpage and the stiffness of theadherends. Temperatures are recommended are at the
Storage乐泰 ABLESTIK film products can be stored at -40°C for up toone year. The shelf life of the film is only valid when the material hasbeen stored at the specified storage conditions. Incorrect storageconditions will degrade the performance of the material in final curedproperties. Avoid flexing film when frozen. 乐泰 ABLESTIK 561K设计用于衬底附着和加热水槽粘接。该粘合膜设计用于粘接材料严重不匹配的热膨胀系数。所有数据结果将随不同的厚度而变化。
固化材料的典型特性
工作生活@ 25°C，第183天
保质期@ -40°C，365天
闪点 - 见SDS
典型的固化性能
治愈时间表
在150°C 30分钟
替代治疗时间表
125°C下2小时
百分比挥发物
10×10cm样品在120℃下30分钟，％0.16
固化胶粘剂在压力下确保适当推荐使用被粘物表面的润湿。压力需求将根据（2至200 psi）变化被粘物的翘曲程 |
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