ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/ECCOBOND 57C电子组装/工业胶水/电子组装胶水/工业用胶
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乐泰 ABLESTIK 57C adhesive is designed to make electricalconnections where hot soldering is impractical and room temperaturecure is required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Part A Properties Part A
Density , g/cm3 3.5
Shelf Life @ 25°C (from date of manufacture), days 120
Flash Point - See SDS
Part B Properties Part B
Density , g/cm3 3.1
Shelf Life @ 25°C (from date of manufacture), days 120
Flash Point - See SDS
Mixed Properties
Density , g/cm3 3.5
Working Time, 100 g mass, @ 25 °C, minutes 60
TYPICAL CURING PERFORMANCE
Cure Schedule
16 to 24 hours @ 25°C
3 hours @ 65°C
45 minutes @ 100°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store in original, tightly covered containers in clean, dry areas.Storage information may be indicated on the product containerlabeling.Optimal Storage : 25 °C 乐泰 ABLESTIK 57C粘合剂设计用于制造电气热焊接不切实际和室温的连接治愈是必需的。
固化材料的典型特性
A部分属性A部分
密度，g / cm 3 3.5
保质期@ 25°C（从制造日期），第120天
闪点 - 见SDS
B部分属性B部分
密度，g / cm 3 3.1
保质期 |
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