ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/ECCOBOND A164-1电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 20,000
Shelf Life:
@ 0 to 8oC, months 4
@ 18 to 25oC, months 3 Density, ASTM-D-792, g/cc 1.1
ECCOBOND A164-1 provides the following product characteristics:
Technology Epoxy
Appearance Tan
Cure Heat cure
Product Benefits • Non-conductive
• Good adhesion
• Good peel strength
• Excellent thermal shock resistance
• One component
Application Automotive Electronics Substrates Metals, Glass and Plastics
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
固化材料的典型特性
粘度@ 25℃，mPa•s（cP）20,000
保质期：
@ 0至8oC，月4
@ 18至25oC，月3密度，ASTM-D-792，g / cc 1.1
ECCOBOND A164-1提供以下产品特性：
技术环氧树脂
外观谭
治疗热固化
产品优点•不导电
•附着力好
•良好的剥离强度
•优异的耐热冲击性
•一个组件
应用汽车电子基材金属，玻璃和塑料以上治疗方案是指导性建议。固化条件（时间和温度）可能会根据客户 |
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