ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/ECCOBOND E8502-1电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND E8502-1 is a solventless modified epoxyadhesive that combines low stress with good adhesion onnearly all surfaces and is flexible for mismatched CTEapplications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa•s (cP):
Speed 10 rpm, # 6 40,000 to 50,000
Specific Gravity 1.15 to 1.2
Shelf Life @ -25 to -18°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
90 minutes @ 120°C or
60 minutes @ 150°C or
15 minutes @ 175°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -25 to -18 °C
ECCOBOND E8502-1是一种无溶剂改性环氧粘合剂，在低于所有表面的情况下结合了低应力和良好的粘附力，并且对于错配的CTE应用是灵活的。
固化材料的典型特性
粘度，Brookfield，25°C，mPa•s（cP）：
速度10 rpm，＃6 40,000到50,000
比重1.15〜1.2
保质期@ -25至-18°C，月6
闪点 - 参见MSDS
典型的固化性能
治愈时间表
120分钟或90分钟
在150°C或60分钟
175°C 15分钟
以上治疗方案是指导性建议。保养条件（时间和温度）可能会根据客户的经验和应用要 |
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