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技术服务热线：021-51693135 / 021-22818476
Product 3888 is designed for bonding of metals, ceramics,
rubbers and plastics as used in electronic parts, where good
adhesion combined with electrical and thermal conductivity is
required. Typical applications include solder replacement,
repair/rework of interconnections, and bonding of heat
sensitive components where solder temperatures are
impractical.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25°C 2.50
Hardness, Shore D 89
Mix Ratio, Resin: Hardener 100:6
Pot life, minutes 90
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to room
temperature heat for 24 - 48 hours. Rate of cure and final
strength will depend on the residence time at the cure
temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength
developed with time at different temperatures. These times are
defined from the moment the adhesive reaches cure
temperature. In practice, total oven time may be longer to allow
for heat up period.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
If supplied as separate containers of parts A and B, store
at room temperature for up to 6 months. If supplied
pre-mixed and frozen, store at -40°C for up to 1 year. Shelf
life will vary with speciality packages
产品3888专为金属，陶瓷，
橡胶和塑料用于电子零件，哪里好粘合结合电导热性
需要。典型应用包括焊料更换，互连的修复/返修以及热的粘合焊料温度敏感的组件不切实际的。
固化材料的典型特性
比重@ 25°C 2.50
硬度，Shore D 89
混合比，树脂：固化剂100：6
可用寿命，90 |
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