1 Scope
1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.
1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.
1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.
1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.
(一) FR-4,FR-4.1,FR-5单面板及双面板认证申请
(二) cem-1,cem-3单面板及双面板申请
(三) FR-1,FR-3单面板及双面板申请
(四) FR-4多层板申请
(五) 单面铝基板仅燃烧认证和全认证申请
(六) 双面铝基板仅燃烧认证和全认证申请
(七) 多层铝基板仅燃烧认证和全认证申请
(八) 铜基板 单面,双面,多层 仅燃烧认证和全认证申请
(九) 柔性线路板(软板)仅燃烧认证和全认证申请
(十) 软硬结合板仅燃烧认证和全认证申请
(十一) 线路板基材认证申请
(十二) 线路板油墨认证申请
(十三) 覆盖膜,电磁膜,屏蔽膜认证申请
(十四) 已有UL,增加CUL认证申请
(十五) 其他认证申请
(十六) XPC板材 22f板材 HB板材 V0板材
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