乐泰 ABLESTIK 8387A乐泰胶水,贴片胶
乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶乐泰 ABLESTIK 8387A乐泰胶水,贴片胶
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乐泰 ABLESTIK 8387A贴片胶适用于高通量智能卡贴合应用。
典型的固化性能
治疗Schedule2分钟@ 150°C
替代治疗时间表125分钟125°C
Cure10 x 10 mm Si的重量损失在玻璃载玻片上死亡,%1
存储
将产品存放在未开封的容器中,干燥处。存储信息可能在产品容器标签上显示。*佳存储:-40至-20°C从容器中取出的物质在使用过程中可能会受到污染。 不要将产品返回原来的容器。
乐泰 ABLESTIK 8387A die attach adhesive is designed for high throughput smart card bonding applications.
TYPICAL CURING PERFORMANCE
Cure Schedule2 minutes @ 150°C
Alternate Cure Schedule15minutes @ 125°C
Weight Loss on Cure10 x 10 mm Si die on glass slide, % 1
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage : -40 to -20 °C Material removed from containers may be contaminated during use. Do not return product to the original container |
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