TRA-BOND 789-3乐泰胶水,电子胶水
TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水TRA-BOND 789-3乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
单组分高强度增韧粘合剂专为微电子应用而设计,包括衬底附着和封装密封,需要良好的防潮性能。 它对难熔金属(如金,银和铜)表现出很强的附着力。 该粘合剂在暴露于水分后保持其粘合强度。 TRA-BOND 789-3提供各种颜色以适应应用。
固化时间30.0 min @温度150°C
0.500小时@温度302°F
60.0分钟@温度125°C
1.00小时@温度257°F
Material Notes:TRA-BOND 789-3 one component, high strength toughened adhesive is designed for microelectronic applications, including substrate attach and package sealing, which require good moisture resistance. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver and copper. This adhesive retains its bond strength after exposure to moisture. TRA-BOND 789-3 is available in a variety of colors to fit the application.
Cure Time 30.0 min@Temperature 150 °C
0.500 hour@Temperature 302 °F
60.0 min@Temperature 125 °C
1.00 hour@Temperature 257 ° |
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