ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC
ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC
ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC
ABLEBOND 2030SC die attach adhesive has been formulated
for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes。压力低，低温快速固化 低弹性模量
本公司专业提供电子胶黏剂、乐泰 乐泰胶等产品服务和相关技术咨询，欢迎广大新老朋友就电子胶黏剂、乐泰 乐泰胶等方面的问题与我们沟通交流。
技术服务热线：021-51693135 |
|
手机站
您当前位置是：产品大全 >> 化工 >>
胶粘剂
免责声明：以上所展示的信息由会员自行提供，内容的真实性、准确性和合法性由发布会员负责，www.qy6.com对此不承担任何责任。如有侵犯您的权益，请来信通知删除。
10
联系信息
