ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55
ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55
ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55
ECCOBOND 55 is an unfilled, low viscosity, general purpose epoxy adhesive resin that can be cured with a variety of catalysts. It features good wetting of most substrates and offers good chemical, solvent and water resistance. ECCOBOND 55 bonds well to glass, ceramics, metals and plastics.
本公司专业提供电子胶黏剂、乐泰 乐泰胶等产品服务和相关技术咨询，欢迎广大新老朋友就电子胶黏剂、乐泰 乐泰胶等方面的问题与我们沟通交流。
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