汉高汉高乐泰乐泰 贴片红胶Chipbond 3619
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乐泰 3619
3619™ is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.22
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
200 to 450LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
1 to 4
Particle Size, μm <100
Flash Point - See MSDS
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity curve as measured using a Haake rotoviscometer PK100, M10/PK1 2° Cone system at a shear rate of 2 s -1 which is representative of the shear rate in the dispense nozzle. Increased cabin or nozzle temperature in the 30°C to 35°C range may aid dispense performance at higher dispense speeds.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 30 minutes @ 100 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K
-1:
Temperature Range: -30 °C to +30 °C 60
Temperature Range: 70 °C to 150 °C 120
Density, BS 5350-B1 @ 25 °C, g/cm3 1.3
Glass Transition Temperature, ASTM D 4065, °C 50
Electrical Properties:
Volume Resistivity, IEC 60093, Ω·cm 1.2×1015
Surface Resistivity, IEC 60093, Ω 19×1015
Electrolytic Corrosion, DIN 53489 A - 1
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
30
Dielectric Constant / Dissipation Factor, IEC 60250:
1-kHz 3.24 / 0.02
100-kHz 3.05 / 0.03
1,000-kHz 2.89 / 0.04
10,000-kHz 2.75 / 0.05
Surface Insulation Resistance, Ω:
IPC TM 650 2.6.3.1:
Test Board: IPC-B-25A, comb pattern D:
Initial 200×109
Aged for 7 days @ 50 °C, 90 % RH 550×10
乐泰3619
3619™是专为表面粘接安装设备的印刷电路板波峰焊 |
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