汉高汉高乐泰乐泰 贴片红胶Chipbond 3621
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乐泰 3621
乐泰 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. 乐泰 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.22
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
130 to 280LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
0.5 to 3
Particle Size, μm <150
Flash Point - See SDS
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity curve as measured using a Haake rotoviscometer PK100, M10/PK1 2° Cone system at a shear rate of 2 s -1 which is representative of the shear rate in the dispense nozzle. Increased cabin or nozzle temperature in the 30°C to 35°C range may aid dispense performance at higher dispense speeds.
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K) 0.3
Density, BS 5350-B1 @ 25 °C, g/cm3 1.16
Glass Transition Temperature, ASTM D 4065, °C 110
乐泰 3621
乐泰 3621是设计表面安装器件接for the prior to to印制电路板波焊锡。特别是在非常高的suited for应用提供高速、高湿强度点轮廓，和良好的电气特性是必需的。特别是在速大于35000 suited提供嫁妆/ H are required。用乐泰 3621 has been successfully铅自由过程以及水和醇基通量条件下部分概述in the环境阻力。
uncured材料的典型性能
比重：25℃1.22
屈服点，25℃，PA
平锥与血流计：
Haake PK 100，M10 / PK 1 2°锥
280lms 130 to
卡森粘度”25°C，pa∙s
平锥与血流计：
Haake PK 100，M10 / PK 1 2°锥0.5～3
颗粒尺寸，μ＜15
See SDS闪光点
粘度与温 |
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