HYSOL GR750-SC电子胶水/塑封胶水/汉高乐泰胶水/塑封方案
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Hysol®GR750-SC™ is an epoxy molding compounddesigned to improve thermal management in semiconductordevices.
TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 26Spiral Flow, @ 175°C, cm 45Shelf Life:@ 5oC, months 12Hot Hardness,Shore-d @ 175°C, 90 second 85Flash & bleed, mm:3.0 mil 32.0 mil 11.0 mil 10.5 mil 30.25 mil 2TYPICAL PROCESS DATAHandlingPreheat Temperature 85 to 95Molding Temperature, °C 170 to 190Molding Pressure, Kg/cm2 45 to 85Transfer Time, seconds 12 to 20Curing Time, 3 mm section:@ 170oC, seconds 90 to 120@ 190oC, seconds 75 to 105Post Cure @ 175°C, hours 4 to 6GR750-SC™ has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible.
Although molding and curing conditions will vary from situationto situation, recommended starting ranges are shown above.StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Powder Storage - Powder or preforms should be stored at 5oCor below, in closed containers. After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisturecontamination.
The suggested waiting time for a standard 15kg carton box is 24 hours.
Hysol®GR750-SC™是一种环氧树脂模塑料，用于改善半导体器件的热管理。
固化材料的特性特性时间@ 175°C秒秒螺旋流@ 175°C，45°寿命：@5oC，月12硬度，岸-d @ 175℃，90秒85闪点和放电，mm：3.0密耳32.0密耳11.0密耳10.5密耳30.25密耳2特殊工艺数据处理预热温度85至95塑型温度，℃170至190℃成型压力Kg / cm 2 45〜85转印时间秒12〜20℃固化时间3mm截面：@170oC，秒90〜120 @190oC，秒75〜105℃固化@ 175℃，小时4〜6GR750-SC™已经配制成提供尽可能*好的可塑性和宽的成型纬度。
虽然成型和固化条件将因情况而异对于情况，推荐的起始范围如上所示。
储存产品在未开封的容器中，在干燥的位置。
储存信息可能在产品容器标签上指示。
粉末储存 - 粉末或预制件应存放在5oC以下，密闭容器中。
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