ECCOBOND 282电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
ECCOBOND 282 is recommended for bonding metals and ceramics in conjunction with high temperature generating components such as semiconductor devices.
It is a good choice for high speed production lines.
TYPICAL CURING PERFORMANCE Cure Schedule4 hours @ 100°C or1 hour @ 125°C or30 minutes @ 150°C or 15 minutes @ 175°CDIRECTIONS FOR USE1.
Complete cleaning of the substrates should be performed to remove contamination such as oil, grease, scale, mold release and loose foreign matter.
Vinyl surfaces should be cleaned by wiping with clean cloth saturated with methyl ethyl ketone.2. Apply adhesive to all surfaces to be bonded and join together.3.
In most applications only contact pressure is required.
Not for product specifications The technical data contained herein are intended as reference only.
Please contact your local quality department for assistance and recommendations on specifications for this product.StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling.
Optimal Storage: 0 to 8°C. Storage greater than or below 0 to 8°C can adversely affect product properties.
推荐使用ECCOBOND 282将金属和陶瓷与诸如半导体器件的高温发生元件结合使用。对于高速生产线是一个很好的选择。
特殊固化性能在175°C或100°C或100°C或100°C或150°C或150°C的175°C条件下，在175°C或15分钟时，可以在100°C或1小时内固化。
应对基材进行完全清洁，以清除污染物，如油，油脂，水垢，脱模和疏松的异物。
乙烯基表面应用用乙基甲基饱和的干净布擦拭。将粘合剂粘合到要粘合的所有表面上并连接在一起。
在大多数应用中，仅需要接触压力。不适用于产品规格本文包含的技术数据仅供参考。请联系您当地的质量部门以获取有关本产品规格的帮助和建议。
Storage age Store将产品放在未开封的容器中，干燥处。
存储信息可能在产品容器标签上显示。
*佳存储：0至8°C。超过或低于0至8°C的储存可能会对产品性能产生不利影响。 |
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