乐泰 3129电子组装/工业胶水/电子组装胶水/工业用胶
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乐泰 3129 is a one part, heat curable epoxy.
This products designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time.
Typical applications include Memory cards, CCD/Misassembles.
Particularly suited where low curing temperatures are required for heat sensitive components.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.52Viscosity @ 25°C, mPa•s (cP):Hake PK100, Cone PK1, 2°:Shear rate @ 2 s-1 46,000Shear rate @ 20 s-1 12,000Casson Viscosity @ 25 °C, mPa•s (cP):Hake PK100, Cone PK1, 2° 4,200Yield Point, 25 °C, mPa•s 39,000Pot life @ 25 °C, days >21TYPICAL CURING PERFORMANCE Recommended Curing Conditions5 to 10 minutes @ 80 °CNote: With all fast cure systems, the time required for cure depend son the rate of heating.
Conditions where a hot plate or heat sink issued are optimum for fastest cure.
Cure rates depend on the mass of material to be heated and intimate contact with the heat source.
Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.
TYPICAL PROPERTIES OF CURED MATERIAL Cured for 30 minutes @ 80 °Physical Properties: Coefficient of Thermal Expansion, ISO 11359-2, K-1:alpha 1 47alpha 2 145Glass Transition Temperature, °C:(Tg) via DMA 35Storage Modulus, @ 25°C by DMA GPa 5.4 (psi) (780,000)Storage Store product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling. Optimal Storage: -15 °C to -25 °C.
Storage below minus (-)25 °Cor greater than minus (-)15 °C can adversely affect product properties.
乐泰 3129是热固化环氧树脂的一部分。
该产品设计用于在低温下固化，并在短时间内在各种材料上提供优异的粘合性。
典型应用包括存储卡，CCD / CMOS组件。特别适用于热敏组分需要低固化温度的特性。25℃下的固化材料特殊重力1.52粘度，mPa•s（cP）：Hake PK100，锥形PK1,2°：剪切速率@ 2 s -1 46,000干燥速率@ 20 s-1 12,000卡森粘度@ 25°C，mPa•s（cP） |
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