ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND G757HF photo curable adhesive is designed for high throughput assembly operations.
TYPICAL PROPERTIES OF UNCURED MATERIAL Density , g/cm3 1.15Sag Resistance (45o angle), mm:@ 25oC 1.88@ 150oC 3.1Shelf Life @ 0°C, months 6Flash Point - See MSDSTYPICAL CURING PERFORMANCE Cure Schedule45 minutes @ 140°C20 minutes @ 160°C or10 minutes @ 180°C or Post Cure2 to 4 hours at the highest expected use temperature This product generates high heat during cure.
No adverse exothermeffects are obtained when cured in bond thicknesses less than or about 0.125 inches (3.2 mm).
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Hardness, :Shore D @ 25oC 44Shore A @ 120oC 35.
Storage Store product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.
Optimal Storage: 0°C.
Storage greater than or below 0°Ccan adversely affect product properties.
ECCOBOND G757HF可光固化粘合剂专门设计用于高输出组装操作。
固化材料的特性密度，g /cm31.15抗锯齿性（45o角），mm：@25oC1.88@150oC3.1Shelf寿命@ 0°C，6个闪点 - 参见MSDSTYPICAL CURING PERFORMANCECURE Schedule 160分钟@ 160°C，180°C或180°C 10分钟或固化2至*高预期使用温度下4小时本产品产生高热量治愈期间当焊接厚度小于或小于0.125英寸（3.2毫米）时，不会产生不利的放热效应。
上述固化曲线是指导性建议。
保养条件（时间和温度）可能会根据客户的经验和应用要求，以及定制设备，烤箱装载和实际烤箱温度而有所不同。
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