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技术服务热线：021-51693135 / 021-22818476
QMI 529HT is a highly silver filled, conductive adhesive designed to provide high (6-7 W/m°K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to metallic lead frames. The materialism hydrophobic and stable at high temperatures.
These features produce void-free bond lines with excellent adhesive strength to a wide variety of metals and ceramic surfaces, including copper, silver-plated copper, preplaced lead frames(Nordau) and Alloy 42. A package or device manufactured with QMI 529HT will have high resistance to delaminating andpopcorning after multiple exposures to lead-free solder reflow temperatures.
The QMI 529HT is designed to achieve UPHsseveral orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through inline cure, either on the die bonder using a post die bond heater or on the wire bonder preheated.“This product and its use may be covered by patent 5,717,034 and bygone or more pending patent applications.”TYPICAL APPLICATIONS This product was developed as soft-solder replacement or for applications that require higher thermal or high electricalconductivityCURE SCHEDULEQMI 529HT can be cured using a variety of times and temperatures, depending on the specific cure equipment.
please contact your nearest 乐泰 Electronic Materials representative.
QMI 529HT是一种高度银填充，导电粘合，可提供高（6-7 W / m°K）导热性和出色的导电性，用于将集成电路和组件连接到金属引线框。
材料在高温下疏水且稳定。这些特征产生对多种金属和陶瓷表面具有优异的 |
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