乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/乐泰 3128电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on aide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies.
Particularly suited where low curing temperatures are required for heat sensitivecomponents.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.6Yield Point, 25 °C, mPa•sCone & Plate Rheometer44,000Casson Viscosity @ 25 °C, mPa•s (cP)Cone & Plate Rheometer7,000 to 27,000LMSPot life @ 25 °C, weeks 3Shelf Life @ -25 to -15 °C, days
TYPICAL PROPERTIES OF CURED MATERIAL Cured for 60 minutes @ 80 °Physical Properties Density @ 25 °C, g/cm3 1.7Volume Shrinkage, ASTM D 792, % 3.1Linear Shrinkage, ASTM D 792, % 1.0Shore Hardness, ISO 868, Udometer D 88Glass Transition Temperature, °C:(Tg) via TMA , ISO 11359-2 45Coefficient of Thermal Expansion, ISO 11359-2, K-1:alpha 1 40×10-6alpha 2 130×10-6Water Absorption, ISO 62, %:24 hours in water @ 23 °C 0.17Elongation, at break, ISO 527-3, % 2.3StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling. Optimal Storage: -15 °C to -25 °C. Storage below minus (-)25 °Cor greater than minus (-)15 °C can adversely affect product properties.
乐泰 3128是热固化环氧树脂的一部分。
该产品设计为在低温下固化，并在相当短的时间内在各种材料上提供优异的附着力。典型应用包括存储卡，CCD / CMOS组件。特别适用于热敏组分需要低固化温度。
固化材料的特性：25° |
免责声明：以上所展示的信息由会员自行提供，内容的真实性、准确性和合法性由发布会员负责，www.qy6.com对此不承担任何责任。如有侵犯您的权益，请来信通知删除。