ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND G909 is designed for very high strength structuralbonding especially for dissimilar substrates that will beexposed to a wide range of operating temperatures.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity 1.15
Press Flow, seconds 65
Sag Resistance, mm 12.7
Shelf Life @ 0 to 4°C (from date of manufacture), months 4.5
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
90 minutes @ 100°C or
30 minutes @ 120°C or
20 minutes @ 150°C
Post Cure
2 to 4 hours at the highest expected use temperature
Cure schedules are "the time at cure temperature to achieve fullproduct cure". The times does not include the time required toramp-up to cure temperature.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 4°C. Storage greater than or below 4°Ccan adversely affect product properties. ECCOBOND G909设计用于非常高强度的结构特别适用于将要使用的不同基材暴露于广泛的工作温度。
固化材料的典型特性
比重1.15
按流，秒65
阻力，mm 12.7
保质期为0至4°C（从制造 |
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