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EO1086 epoxy encapsulate is designed for use in applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous service to177 °C.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity, Brookfield , 25 °C, mPa•s (cap):Spindle 7, speed 10 rpm 62,500Specific Gravity @ 25 °C 1.58
Filler Content, % 50Gel Time @ 121oC, minutes 8.1Pot Life @ 25oC, days 7Shelf Life @ 4°C, months 6Flash Point - See MSDSTYPICAL CURING PERFORMANCE Recommended Cure Schedule30 minutes @ 120°CAlternative Cure Schedule20 minutes @ 130°C15 minutes @ 150°CThe above cure schedules represent actual bond line/material temperatures.
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based noncustomers’' experience and their application requirements, swell as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion :Below Tag, pap/°C 43Above Tag, pap/°C 135Glass Transition Temperature (Tag) by TMA, °C 137StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 2 to 8 °C. Storage greater than 8 °C can adversely affect product properties.
EO1086环氧密封剂设计用于需要优异处理性能的应用。固化的材料会严重的发生热冲击，并提供连续使用温度至177°C。
固化材料的性能特性粘度，布鲁克菲尔德，25°C，map’s（cap）：主轴7，转速10 rpm 62,500特定重力@ 25°C 1.58填充内容，％50Gel时间@121oC，分钟8.1Pot寿命@25oC，天7Shelf寿命@ 4°C，6个闪点 - 见MSDSTYPICAL CURING PERFORMANCER推荐治疗计划30分钟@ 120°CA替代治疗时间表20分钟@ 130°C 15分钟@ 150°上 |
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