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胶水公司
联系人:王小姐
女士 (主管) |
电 话:021-51693135 |
手 机:13052326431 |
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ECCOBOND CE3104WXL电子组装/工业胶水/电子组装胶水/工 |
ECCOBOND CE3104WXL电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线:021-51693135 / 021-22818476
乐泰 ABLESTIK CE 3104WXL is an electrically conductiveepoxy adhesive that is a Pb-free alternative to solder. Thisproduct uses a unique blend of fillers with tightly controlledparticle sizes to provide ultra-fine pitch resolution (<500μm)when printed using either a stainless steel mesh screen or ametal mask stencil. The lower surface tension versus soldermeans no bridging on fine-pitch assembly patterns.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index 6.0
Viscosity at 25°C, mPa•s (cP)
(Plate 2 cm at 15 s
-1 )
65,000
Work Life @ 25°C, days 3
Shelf Life @ -40°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
Reflow:
3 minutes @ 150°C or
5 minutes @ 125°C
Convection:
8 minutes @ 125°C or
5 minutes @ 150°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40 to -35°C. Storage below -40°C canadversely affect product properties (freeze-thaw voids).乐泰 ABLESTIK CE 3104WXL是导电的环氧树脂粘合剂,是无铅焊料替代品。这个产品使用独特的填料混合物,具有严格的控制粒径提供超细间距分辨率(<500μm)当使用不锈钢筛网或a金属面膜模具。较低的表面张力对焊料意味着在细间距装配模式上没有桥接。
固化材料的典型特性
触变指数6.0
25℃下的粘度,mPa•s(cP)
(板15厘米2厘米
-1)
65,000
工作生活@ 25°C,第3天
保质期@ -40°C,365天
闪点 - 见SDS
典型的固化性能
治愈时间表
回流:
在150°C或3分钟
125°C 5分钟
对流:
在125°C或8分钟
150分钟5分钟
以上治疗方案是指导性建议。治愈条件(时间和温度)可能会有所不同客户的经验和应用要求
以及客户固化设备,烤箱装载和实际烘箱温度。
存储 将产品存放在未开封的容器中,干燥处。 |
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