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UF3800 reworkable epoxy underfill is designed for CSP and
BGA applications. It cures quickly at moderate temperatures to
minimize stress to other components, and when cured provides
excellent mechanical stress protection for solder joints.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25°C, MPa
Physica MCR100,
Spindle CP50-1, 1000S-1
375
Specific Gravity 1.13
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
≥8 minutes @ 130°C
Note: This is a bondline / material temperature.
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion ppm/°C:
Below Tg, ppm/°C 52
Above Tg, ppm/°C 188
Glass Transition Temperature (Tg) by TMA, °C 69 Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -25 to -15°C. Storage below -25°C or
greater than -15°C can adversely affect product properties. UF3800可再循环环氧底层填料适用于CSP和
BGA应用。它能在适中的温度下快速固化
*小化对其他部件的应力，并且在固化时提供
良好的焊接接头机械应力保护。
固化材料的典型特性
粘度@ 25°C，MPa
Physica MCR100，
主轴CP50-1,1000S-1
375
比重1.13
25℃的天气，第3天
保质期@ -20°C，月6
闪点 - 参见MSDS
典型的固化性能
治愈时间表
130°C时≥8分钟
注意：这是一个粘合线/材料温度。
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