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乐泰® 3551 is a one component heat cure epoxy 1. Receiving Cold Shipments
designed for use as board level underfill for IC packages, such
as CSPs and BGAs. It is designed to cure at low temperature
to reduce thermal stress to other components and fast flow to
achieve fast filling of space under the package. When fully
cured, it provides excellent protection to the solder joints from
mechanical stress.
All shipping boxes are packed with cold gel packs to
maintain temperature below 8o
C during transit.
2. Temperature Equilibration
A new package of material can be brought to ambient
conditions by allowing to stand at room temperature
(22±2 oC) for 1 to 2 hours (actual time required will
TYPICAL APPLICAT vary with package size / volume). IONS
Board Level CSP/BGA Underfill
PROPERTIES OF UNCURED MATERIAL
Typical
Value
Chemical Type Epoxy
Appearance Black
Specific Gravity @ 25°C 1.12
Viscosity@25°C, m Pa s
(Haake PK100, PK1 2°Cone
Constant Shear rate @ 36 sec.-1)
2000
Pot life @ 22°C 7 days
Flow Time@23°C, glass to glass, 12.7mm flow
0.080mm gap
6 min 45 sec
乐泰®3551是一种单组分热固化环氧树脂1.接收冷运输
设计用作IC封装的板 |
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