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乐泰®
3523™ is used to bond, seal or coat metal and
glass components in industrial applications. This product is
suitable for reinforcement of flexible PCB and for bonding a
wide range of materials. When cured, it offers excellent
flexibility and toughness, making it highly resistant to vibration
and impact forces.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.06
Refractive Index, ASTM D 1218 1.48
Flash Point - See MSDS
Viscosity, Brookfield - RVF, 25 °C, mPa•s (cP):
Spindle 6, speed 20 rpm 16,000 to 24,000LMS
TYPICAL CURING PERFORMANCE
乐泰®
3523™ cures when exposed to UV radiation of 365
nm. To obtain full cure on surfaces exposed to air, radiation @
220 to 260 nm is also required. The speed of cure and depth of
cure will depend upon the UV intensity and spectral distribution
of the light source, the exposure time and the light
transmittance of the substrates. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or
greater than 28 °C can adversely affect product properties
乐泰®
3523™用于粘合，密封或涂上金属和
玻璃组件在工业应用中。这个产品是
适用于加强柔性PCB和粘接a
范围广泛的材料。治愈时，它提供优秀
灵活性和韧性，使其具有高抗振性
和冲击力。
固化材料的典型特性
比重@ 25°C 1.06
折射率ASTM D 1218 1.48
闪点 - 参见MSDS
粘度，Brookfield - RVF，25℃，mPa•s（cP）：
主轴6，转速20rpm 16,000至 |
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