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技术服务热线：021-51693135 / 021-22818476
乐泰 3128 is a one part, heat curable epoxy. This product is
designed to cure at low temperature and gives excellent adhesion on a
wide range of materials in considerably short time. Typical applications
include Memory cards, CCD/CMOS Assemblies. Particularly suited
where low curing temperatures are required for heat sensitive
components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.6
Yield Point, 25 °C, mPa•s
Cone & Plate Rheometer
44,000
Casson Viscosity @ 25 °C, mPa•s (cP)
Cone & Plate Rheometer
7,000 to 27,000LMS
Pot life @ 25 °C, weeks 3
Shelf Life @ -25 to -15 °C, days 365
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
20 minutes @ 80 °C bondline temperature
60 minutes @ 60 °C bondline temperature
Note: Sufficient time must be added to allow the bond location to
reach the desired cure temperature. Curing profiles should be
developed for each device. Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: -15 °C to -25 °C. Storage below minus (-)25 °C
or greater than minus (-)15 °C can adversely affect product
properties
乐泰 3128是热固化环氧树脂的一部分。这个产品是
设计用于在低温下固化并且在a上具有优异的附着力
广泛的材料在相当短的时间内。典型应用
包括存储卡，CCD / CMOS组件。特别适合
其中热敏感需要较低的固化温度
组件。
固化材料的典型特性
25°C时的比重1.6
产量点，25℃，mPa•s
锥板流变仪
44,000
卡松粘度@ 25℃，mPa•s（cP）
锥板流变 |
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