汉高汉高乐泰乐泰 UF 3800
技术服务热线：021-51693135 / 021-22818476
乐泰 ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Physica MCR100 @ 25°C, mPa∙s (cP):
Spindle CP50-1, Shear Rate 100s
-1 375
Specific Gravity 1.13
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, days 274
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
≥8 minutes @ 130°C
The above cure schedules represent actual bondline/material temperatures.
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties :
Coefficient of Thermal Expansion ppm/°C:
Below Tg, ppm/°C 52
Above Tg, ppm/°C 188
Glass Transition Temperature (Tg) by TMA, °C 69
Storage Modulus, 25°C, GPa 3.08
Electrical Properties:
Dielectric Constant @ 23oC :
@ 1GHz 2.97
@ 2GHz 2.8
Dissipation Factor @ 23oC:
@ 1GHz 0.0174
@ 2GHz 0.0022
乐泰eccobond UF 3800返修的环氧填充用于CSP、BGA应用。它在温和的温度下迅速固化，以尽量减少对其他部件的应力，当固化提供了良好的机械应力保护焊点。
固化材料的典型性能
粘度、物理mcr100 @ 25°C，MPA∙S（CP）：
主轴cp50-1，剪切速率100s
375 - 1
比重1.13
锅生活@ 25oC，3天
保质期@ 20°C，天274
闪点-见SDS
典型的固化性能
治疗计划
≥8分钟@ 130°C
上述治疗计划代表实际的胶层/材料温度。
上面的固化轮廓是指南推荐。固化条件（时间和温度）可能会根据客户的经验和他们的应用要求，以及客户固化设备，烘箱负荷和实际烤箱温度变化。
固化材料的典型性能
物理性质：
热膨胀系数°ppm / C：
低于Tg，PPM /°C 52
Tg以上，PPM /°C 188
玻璃化转变温度（Tg）通过TMA，°C 69
储能模量， |
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